Your Responsibilities 1. Manage new project daily work 2. Follow up with TD engineer for the NPI checklist, tooling readiness, material readiness and follow up on the qulification plan 3. Follow up the plan with TD engineer and operations for the ES/QS build and special requirement of the builds 4. Follow up the plan of SW, IWV,IEV for new platform TV 5. NPI LT management 6. Support TD dashboard, Integrate with TD enigneer, Quality engineer and operations 7. Support HVM readiness Your Profile 1. Degree from university or higher technical college mechanical/electrical/automation 2. Process engineering experience in IC-Substrate, HDI-PCB, Assembly, IC-Packaging or related industry 3. Experience in working with intercultural teams preferred 4. Knowledge of project management, data evaluation and design of experiments 5. Experience in Factory automation 6. Background in equipment integration into MES 7. Knowledge in communication protocols within equipment/equipment/host systems like SECSGEM, OPC, TCPIP, SMEMA, semi e84 8. Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP, etc 9. Good analytical skills with attention to details. 10. Good stress management skills 11. Fluent written and oral English necessary(Mandarin would be of advantage) 12. Good team working spirit and leadership skills 13. Good communication and negotiation skills 14. Computer skills – MS Office Package (Word, Excel) 15. Willingness to travel and stay abroad for a certain time in one or our locations 16. Open minded approach